Control system for Fine-Wire/Heavy-Wire Bonder.

The Paderborn high-tech company Hesse & Knipps GmbH develops and delivers customer specific equipment for the semiconductor assembly industry. Bonders, ultrasonic flip-chip systems, custom systems -even complete product lines - are delivered worldwide to industrial semiconductor customers.

BONDJET BJ820 Thin Wire Wedge Bonder is the latest development using Hesse & Knipps‘ wedge bonding technology, meeting all wire bonding challenges on a single platform. Varied applications can all be met, such as RF and microwave devices, COB, MCM and hybrids, fibre-optics and automotive applications, using aluminium wire, gold wire or ribbon. 

BJ820 defines the industry benchmark by offering:

• the fastest wiring speed of any wedge bonder
• the largest work area
• the greatest axis accuracy

Hesse & Knipps‘ innovations and their focus on future semiconductor production technologies required the evaluation of a new control concept for their standard machnines as well as all their other products.

Janz Tec AG, situated close by, partnered with them in the development of a comprehensive new control system. The main task was to replace the previous outdated computer system in a way that re-fitting existing machines with new control units is no problem. This way, warehousing two different controller components can be avoided. In addition, the systems allow for future requirements and challenges. A control unit consists of up to three Core2Quad processor boards contained together in one housing and sized to the requirements of existing machines.

The control unit is configured as an HMI computer to allow easy user-control of the machine.

The second unit provides motion control and regulation, and is a conventional real-time controller. 

An optional third unit forms an integrated quality control processor (PiQC), performing real-time bond tests. 

In addition to the quality standard power supply, uncontrolled data loss from the PiQC unit is prevented by a UPS unit.

The development of the housing and the component selection for the three computer cores was a close cooperation between Janz Tec AG and Hesse & Knipps GmbH.

Here you can view the full reference report.