The Paderborn high-tech company Hesse & Knipps GmbH develops and delivers customer-specific equipment for the semiconductor assembly industry. Bonders, ultrasonic flip-chip systems, custom systems - even complete product lines - are delivered worldwide to industrial semiconductor customers. 

BONDJET BJ820 Thin Wire Wedge Bonder is the latest development using Hesse & Knipps‘ wedge bonding technology, meeting all wire bonding challenges on a single platform. Varied applications can all be met, such as RF and microwave devices, COB, MCM and hybrids, fiber-optics and automotive applications, using aluminum wire, gold wire or ribbon. 

BJ820 defines the industry benchmark by offering: 

• the fastest wiring speed of any wedge bonder 
• the largest work area 
• the greatest axis accuracy  

Hesse & Knipps‘ innovations - and their focus on future semiconductor production technologies - required the evaluation of a new control concept for their standard machines as well as all their other products. 

Janz Tec AG, situated close by, partnered with them in the development of a comprehensive new control system. The main challenge was to replace the previous outdated computer system in a way that re-fitting existing machines with new control units would be no problem.  So stocking two different controller components has been avoided. In addition, the systems allow for future requirements and challenges. A control unit consists of up to three Core2Quad processor boards in a single housing, and sized to the requirements of existing machines. 

The control unit is configured as an HMI computer to allow easy user-control of the machine. 

The second unit provides motion control and regulation, and is a conventional real-time controller. 

An optional third unit forms an integrated quality control processor (PiQC), performing real-time bond tests. 

In addition to specifying a high-quality standard power supply, emergency data loss from the PiQC unit is prevented by including a UPS unit.  The development of the housing and the component selection for the three computer cores was achieved with close cooperation between Janz Tec AG and Hesse & Knipps GmbH.